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ONESEINE TECHNOLOGY CO.,LTD
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1 Years
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1 Years
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| Brand Name : | ONESEINE |
| Model Number : | ONE-102 |
| Certification : | ISO9001,ISO14001 |
| Price : | USD0.1-1000 |
| Payment Terms : | T/T,Western Union |
| Supply Ability : | 1000000000pcs/mon |
| Delivery Time : | 5-8 working days |
High level FR4 PCBA Case Service Providing Full-Scale Solutions for Complex Circuit Boards
General PCBA Information:
Base material:FR4 epoxy resin
Board thickness:1.6mm
Surface finish:Immersion gold
Board size:7.2*17.3CM
Copper thickness:1OZ
Solder mask and silkscreen: green and white
Components sourcing:yes
Quantity | Prototype&Low Volume PCB Assembly&Mass production(without MOQ) |
Type of Assembly | SMT,DIP&THT |
Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
Components | Passive Down to 0201 size; BGA and VFBGA; Leadless Chip Carriers/CSP |
Bare Board Size | Smallest:0.25*0.25 inches ; Largest:20*20 inches |
File Format | Bill of Materials; Gerber files; Pick-N-Place file |
Types of Service | Turn-key,partial turn-key or consignment |
Component Package | Cut Tape,Tube,Reels,Loose Parts |
Turn Time | Same day service to 15 days service |
Testing | Flying Probe Test; X-ray Inspection; AOI Test |
PCBA Process | SMT--Wave Soldering--Assembling--ICT--Function Testing |
Our PCBA Capability
SMT, PTH, mixed technology
SMT: 2,000,000 solder joints per day
DIP: 300,000 joints per day
Ultra fine pitch, QFP, BGA, μBGA, CBGA
Advanced SMT assembly
Automated insertion of PTH (axial, radial, dip)
Cleanable, aqueous and lead-free processing
RF manufacturing expertise
Peripheral process capabilities
Press fit back planes & mid planes
Device programming
Automated conformal coating
For E-Test
Universal Tester
Flying Probe Open/Short Tester
High power Microscope
Solder ability Testing Kit
Peel Strength tester
High Volt Open & Short tester
Cross Section Molding Kit With Polisher
Technical requirement for pcb assembly:
1) Professional Surface-mounting and Through-hole soldering
Technology
2) Various sizes like 1206,0805,0603,0402,0201 components SMT
technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
Quote requirement for pcb and pcb assembly:
1)Gerber file and Bom list Gerber file,PCB file,Eagle file or CAD
file all acceptable
2)Clear pics of pcba or pcba sample for us This will help a lot for
the fast purchasing as request
3)Test method for PCBA This can guarantee 100% good quality
products when delivered
Assembly Capabilities
· Printed Circuit Board Assembly (PCBA)
· Through Hole
· Surface Mount (SMT)
· PCB Handling up to 400mm x 500mm
· RoHS Compliance Production
· Non RoHS Production – where permitted
· AOI
Component Technologies
· Passive Down to 0201 size
· BGA and VFBGA
· Leadless Chip Carriers/CSP
· Fine Pitch to 0.8mils
· BGA Repair and Reball
· Part Removal and Replacement
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