Customized Copper Core Metal Core PCB for High-Power Electronics

PCB parameter:

Brand:Oneseine

Application: Full range of fluorescent lamps

Maximum size: 1500mm

Substrate material: Aluminum

Thickness: 0.6-2.0mm

Copper foil thickness: 18-70um

Surface treatment: OSP/HAL/HASL (Lead free)

Thermal conductivity: 1.0 – 3.0W/m.k

Breakdown voltage: 1.0-3.0KV(AC)

Flammability: 94V0

Standard: UL & ROHS

Manufacturing Process: Critical Stages & Parameters

Stage 1: Base Preparation

Material: 5052/6061 Al or C1100 Cu

Surface Treatment: Alkaline wash → Anodization (Al) / Antioxidant coating (Cu)

Flatness Tolerance: ≤0.1mm/m²

Stage 2: Dielectric Lamination

Standard Materials: Bergquist HT-04503 (100μm), Laird Tputty506 (150μm)

Thermal Resistance: <0.3°C-in²/W

Breakdown Voltage: >3kV AC

Stage 3: Circuit Fabrication

Copper Weight Options: 1oz (35μm) to 10oz (350μm)

Etching Precision: ±10% line width tolerance

Min. Trace/Space: 0.15mm/0.15mm (LDI process)

Stage 4: Thermal Management Features

Via Fill: Conductive epoxy (0.8-1.5 W/mK)

Plated Through Holes: Aspect ratio 8:1 max

Edge Plating: 360° coverage for chassis grounding

Quality Validation Protocol

Thermal Cycling

Condition: -55°C ↔ +150°C, 500 cycles (IPC-TM-650 2.6.7)

Acceptance: No delamination, <5% resistance change

Thermal Resistance Test

Method: ASTM D5470

Standard: θja <1.5°C/W (for 1.0mm Al core)

High-Potential Test

Voltage: 3kV AC, 60s (UL 796)

Leakage: <5mA