Fluorescent Lamp Aluminum MCPCB Manufacturer Metal Circuit Board

PCB parameter:

Brand:Oneseine

Application: Full range of fluorescent lamps

Maximum size: 1500mm

Substrate material: Aluminum

Thickness: 0.6-2.0mm

Copper foil thickness: 18-70um

Surface treatment: OSP/HAL/HASL (Lead free)

Thermal conductivity: 1.0 – 3.0W/m.k

Breakdown voltage: 1.0-3.0KV(AC)

Flammability: 94V0

Standard: UL & ROHS

Metal Core PCB Variants & Manufacturing Specifications

Material Classification
Metal core PCBs utilize specialized substrates for thermal management:

Aluminum Core (80% market share)

Applications: LED lighting, automotive electronics, power supplies

Advantages: Cost efficiency (¥120-300/m²), thermal conductivity 1-3 W/mK, lightweight (2.7g/cm³)

Copper Core

Applications: RF/microwave systems, high-power converters

Performance: Superior thermal transfer (400 W/mK), 3× aluminum cost, weight penalty (8.96g/cm³)

Iron Alloy Core

Applications: Motor controllers, EMC-sensitive systems

Characteristics: Magnetic permeability >10k μ, thermal conductivity 80 W/mK

Composite Core

Architecture: Aluminum-copper hybrids (e.g., 1.5mm Al + 0.3mm Cu)

Benefit: Balanced thermal-mechanical performance (CTE 14 ppm/°C)

Ceramic Core

Substrates: Al₂O₃ (24-28 W/mK), AlN (170-230 W/mK)

Use Cases: Aerospace power modules, laser diodes

Flexible Metal Core

Construction: Polyimide-on-aluminum (bend radius >5mm)

Applications: Curved displays, wearable medical devices

Production Process

Advanced thermal management PCBs require 18 specialized stages:

Design Phase

Thermal simulation (ANSYS Icepak)

CTE-matching component placement

Base Preparation

Metal core CNC milling (±0.05mm tolerance)

Alkaline degreasing + anodization (Al cores)

Dielectric Lamination

Thermally conductive polymers (e.g., Bergquist HT-04503, 100μm±5μm)

Bonding strength >8N/mm² after 260°C reflow

Circuit Formation

Laser Direct Imaging (25μm feature resolution)

Acidic copper etching (1oz-10oz thickness)

Drilling & Metallization

Laser/mechanical drilling (0.2-6.0mm holes)

Void-free via filling (conductive epoxies)

Surface Finishing

Ni/Au (ENIG): 3-5μm Ni + 0.05-0.1μm Au

Immersion Sn/Ag: Low-cost alternatives

Validation

Thermal cycling (-55°C↔150°C, 500 cycles)

IST testing (1000+ hours @ 150°C)